To create new bonder business mode for new customer.

为新客户创建新的保税贸易模式。

The mountain stretches from the bonder of one country to that of another.

那山脉从一个国家的边界延伸到另一个国家的边界.

This product design for IC assembly die bonding process on die bonder machine.

本产品是为IC封装自动贴片机及其贴片工艺而设计.

This product design for IC assembly die attache process on die bonder machine.

本产品为IC集成电路封装工艺芯片全自动固晶机上而专门设计.

Based on the analysis model, the ultrasonic transfer on the horn of wire bonder was studied.

基于解析模型的方法, 研究了超声波在热超声金丝球引线键合机变幅杆中的传递规律.

The automatic wire bonder is one of the primary equipments in semiconductor back - end production.

自动金丝球焊机是半导体制造后端工序的关键设备之一,图像识别系统是其核心技术.

Die Bonder is manufacturing equipment which binds IC chip onto Lead Frame in semiconductor production.

粘片机是用于将IC芯片粘结到引线框架的半导体器件生产专用装备.

Used functional magnetic pulse therapy treatment, and treatment with Bonder Line there is a clear distinction.

采用磁疗脉冲治疗功能治疗时，与带线粘片治疗有著明显的区别。

Wire Bonder is an important device of IC package. With complex construction, its requirement of runtime and precision are very high.

引线键合机是IC封装的重要设备，其结构精密复杂，对运行速度和控制精度要求极高。

By adding pattern recognition system to IC package equipment, a manual wire-bonder to automatic one was successfully ameliorated.

把图像识别系统应用于IC封装设备中，成功将手动式金丝球焊机改造为全自动金丝球焊机；