银焊料、设置之间的核心部分，加热至熔点以上的债券为核心的部分。

A silver solder, placed between the segment and the core, is heated above the melting point to bond the segment to the core.

提出了简单、快速地同时溶解及测定铜基锡银焊料中锡银的新方法。

A new method for the simultaneous dissolution and determination of tin and silver in copper solder was reported.