Copper base copper clad laminate

铜基覆铜箔板

Aluminum foil copper clad laminate

覆铜箔、铝箔层压板

Epoxide cellulose paper copper clad laminate

覆铜箔环氧纸层压板

High dielectric constant copper clad laminate

高介电常数覆铜板

Phenolic cellulose paper copper clad laminate

覆铜箔酚醛纸层压板

Epoxide woven glass fabric copper clad laminate

覆铜箔环氧玻璃布层压板

Polyimide resin woven glass fabric copper clad laminate

覆铜箔聚酰亚胺玻璃布层压板

Modified polyhenylene oxide resin woven glass fabric copper clad laminate

覆铜箔改性聚苯醚玻璃布层压板

Copper clad laminate, polyimide backed, of a thickness not exceeding 0.07 mm.

铜箔基板，以聚醯亚氨为衬，其厚度在0．07公厘及以下者。

Copper clad laminate, paper-phenolic backed, of a thickness not exceeding 0.07 mm.

铜箔基板，以酚树脂为衬，其厚度在0．07公厘及以下者。