The prober is necessary role in wafer-level analysis of reliability.

在晶圆形式可靠度分析中，承载晶圆的探针台是不可或缺的。

This paper discusses a true wafer level packaging ( WLP ) technology which is called Ultra CSPTM.

文章论述了超CSPTM圆片级封装技术工艺.

This paper discusses a true wafer level packaging (WLP) technology which is called Ultra CSPTM.

文章论述了超CSPTM圆片级封装技术工艺。

Electrostatic bonding is an important encapsulating means for the materials at the chip or wafer level.

静电键合是片状材料封接的一种重要手段,讨论了玻璃在电场作用下的键合过程.

Embodiments of the disclosure include use as a wafer level underfill, and an encapsulant for electronic chips.

本发明的实施方案包括作为晶片级底层填料和电子芯片密封剂的用途。

This paper introduces the background of using Wafer Level Reliability technology, and expounds the characteristics and functions in details.

介绍了圆片级可靠性技术产生的背景，对其特点和作用作了详细的论述。