The simulation results show that the self-alignment process can still work even when the size of the binding site on substrate is different from that on micro-parts.

通过仿真模拟，证明即使在器件与衬底组装区域形状大小不同时，仍可能实现自对准。这说明自组装对组装器件和衬底粘合层的形状尺寸匹配精度的要求不苛刻。