An underfill can cause the device to malfunction.

填充不足可能会导致设备故障。

They need to address the underfill issue before proceeding.

他们需要在继续之前解决填充不足的问题。

The quality control team detected an underfill in the packaging.

质量控制团队在包装中检测到填充不足。

The technician noticed an underfill in the electronic component.

技术人员注意到电子元件中有填充不足的情况。

Engineers are working on a solution to prevent underfill in the future.

工程师们正在研究防止未来填充不足的解决方案。

In this paper we report the analysis of underfill encapsulation between the solder ball, m…

文中主要探讨了覆晶封装底胶充填时，锡球、芯片及基板间的流动状况。

In this paper we report the analysis of underfill encapsulation between the solder ball, micro-chip …

文中主要探讨了覆晶封装底胶充填时，锡球、芯片及基板间的流动状况。

Embodiments of the disclosure include use as a wafer level underfill, and an encapsulant for electronic chips.

本发明的实施方案包括作为晶片级底层填料和电子芯片密封剂的用途。

It was found that the application of underfill encapsulation can improve reliability of flip chip significantly.

证明了在使用下部填充料后，倒装芯片的热应力可靠性将大大提高。

Underfill technology effectively enhances the flip - chip cycle fatigue life and reliability of packaging process.

有机基板上的倒装芯片一般采用底部填充技术以提高其封装的可靠性.